Rolling out a rebrand of Telink Semiconductor's visual identity with a new website, new packaging and print collateral, and merchandise that echoes reach and connectivity
Role: Graphic Designer  |. Year: 2019
3D models made to use as product shots of Telink's many families of chips. Rendered in Photoshop.
Packaging design mockup of mailing kits.  
Custom monospace typeface designed for print on micro chips.
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